Hi Guys,
Can anybody advise me if I'm on the right track regarding airflow and heat dissipation for this design?
Here are some pics of my mini 350mw RGB projector I am building.
The size is the same footprint as a 15" laptop and approximately 50mm high.
I'm building this projector for when I am away from home (which is a lot) so I can practise using the Pangolin software.
The attached pics aren't finished yet. The case will be made of a solid machined aluminium so
imagine the edges of the base plate extruding upwards to make the walls and then a 3mm sheet screwed on top for the lid.
I'm pretty happy with the layout but I'm a bit unsure of airflow and heat dissipation issues.
Hear is a list of the components;
-DT40 Pro scanners
-2x XP POWER ECS25US24 (24v 25w) power supplies
-1x XP POWER ECS45US12 (12v 45w) power supply
-1x Power-One BLP30-3000 G (+5v +12v -12v 30w) Pangolin power supply
-Pangolin QM2000.net and LD2000 Pro DAC
-General scanning GM-20 shutter
-Stanwax ILDA interface board
-Stanwax/DZ colour correction board
-1xCNI 100mW OEM green laser (running up to 100mW)
-1xNichia NDB7242E 445nm blue (running up to approx. 100mW)
-1x Opnext HL6385-E 642nm red diode (running at approx. 150mW)
-3x Die4Drive Pro laser drivers.
-2,3or 4 Sunon MagLev KDE1205FPV2 12vdc 1.1w50mmx 10mm fans
The base will be 8mm thick around the laser/ scanner area as well as the area where the scanner drives sink heat. Ill probably machine the base a bit thiner in the areas that don't require structural rigidity and mass for heat sinking.
The lasers won't be TEC'ed.
The lid won't be vented.
As you can see in the view 2 pic I'm planning on sucking filtered air through the scanner driver side and exhausting through the bottom under the DAC.
Any thoughts would be appreciated.
Thanks
Kit![]()