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Thread: Heat dissipation of base plate

  1. #1
    Join Date
    Apr 2010
    Location
    Grand Rapids, Mi
    Posts
    2,538

    Default Heat dissipation of base plate

    I have a base plate of 3/8th 12X24. I have been playing with pelteir's lately, but have just heatsinked them top side, not sandwiched them between the baseplate and module. How much heat load in watts would you think a baseplate the size of mine could dissipate without heating up the non/tec'd modules if I did sandwich the pelt underneath? Thanks
    leading in trailing technology

  2. #2
    Join Date
    Feb 2011
    Location
    New Hampshire
    Posts
    3,513

    Default

    Too many variables to guess at and so I would do a simple test. The vast majority of the heat to remove from the TEC will be generated by the TEC and not the cooled module, so estimate the power of the TEC by its published or measured VxI product and then place this amount of heat load on to the plate. Clamp a couple of high power resistors to the plate and feel/measure the temp rise. You can add fans and fins as needed. The plate is plenty thick and big. The issue will be removing the heat from the plate. I plan to place 30cm x30cm x 3cm worth of finned Al heat sinks below such a plate and blowing the power supply cooling air over this before the air passes over the supplies and out the case. This is for two cooled modules.

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