Can anyone who has set up their own TEC cooling under their baseplate (rather than the TECs inside commercial modules) give some ideas or suggestions on this? I would like to have a very conservative amount of TEC cooling for my baseplate so I wouldnt have to worry about the diodes overheating as I upgrade and add more. But I also don't want to have the peltiers so close that they interfere with each others operation from the heat generated by each.
The peltier cooler I'm familiar with is TEC1-12706. Let me know if a bigger one might be a good idea.
The TEC is going to be controlled by a dedicated driver: http://www.ebay.com/sch/tomorrowssys...1&_ipg=&_from=
It will be attached to the baseplate with a heatsink plaster, the a CPU cooler attached under it ( http://www.ebay.com/itm/New-Dual-Fan...gAAOSwT5tWGcul )
I'm thinking of placing the thermistor inside the most "center" diode mount of each module.
Base plate thickness is 1cm. I have an older case with 6mm baseplate. I might add a TEC to that one as well when I decide to replace the DPSS modules with diodes.
Should there be 1 TEC for each module, positioned at the middle of the module?
There are 4 CPU fans on left and right of the bottom part of the case, one side blowing air in and the other blowing out, I think should take care of the TEC heat.
Does this all sound good?