Hey,
I will just chime in and help you understand the concept better:
As for the vacuum vs gas fill:
The gas inside the tec housing is just a normal heat conductor, just like iron would be. (however much worse of a conductor)
So sucking the gas out results in "less conductor" so in less heat conduction overall.
Choosing the gas depending on "heat conduction ability" e.g. thermal resistance will lessen the heat load because the gas will be a worse conductor of heat (thus less heat will "reach" the tecs surface).
The pressure of the gas is therefore directly related to the heat load. As well as chamber design. Imagine the iron example from before:
A 1" long iron bar would conduct heat quite fast. Heat one end with a blowtorch -> burn you fingers fast on the other end.
On the other hand, a 100" long iron bar could be heated with a blowtorch and leave you with cold fingers on the far end.
So this example shows: distance is also a factor in heat conduction.
There is also another problem that arrises, thinning the gas will actually increase the "mean free distance". This counters the "less conductor less heat transferred" part a bit. Have a google for mean free path length, much research to do.
All in all: there are multiple factors to calculating the heat load for a given pressure and a given gas. Its not as easy as: 1W for 1mbar and 0,5W for 0,1mbar or something like that.
I did many many hours of research to pull this off. Its easy to mount a diode to a tec, however getting LOW temperatures is quite a challenge and every little detail counts.


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