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Thread: Flexmod graveyard :(

  1. #11
    Join Date
    Mar 2006
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    Nice SMT fun. (I hate SMT). I did discover a few things that help though, one is that sliding very thin feeler gauges under a part can help with removal. Another is that reflow with plenty of solder done swiftly work well, while holding the whole board at an angle that makes use of gravity to help run the excess solder off the pins. Use a flux pen too. Whole rows of very finely packed pins can be handled in a short moment like this. If a pin fails to bond, it's easy to retry the whole row.

    A thing about FET's.. While they take very little current on the gate in a held state, the state change current can be very short and sharp if the input changes fast enough. I remember convincing Maplin to refund me for three Seimens touch dimmer chips (expensive) when I showed that their design diagram should have contained a 100R current limit resistor from chip to triac gate. (But they never reprinted the diagram in future catalogs so I bet other people got stung). While power FET's are not triacs, I think the same thing might work to protect the controlling device's output, and the input to the power stage. Just watch that the resistance isn't so high that it prevents fast modulation.

  2. #12
    Join Date
    Aug 2013
    Location
    West Sussex
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    Quote Originally Posted by dnar View Post
    Double check your soldernpadcwire connections. I had a lot of intermittant issues when I first used these drivers, the pads solder yet they dont due to a conformal coating used....
    Good point dnar. My usual first step is running a soldering iron over everything that looks even in the slightest bit dry. Also, multi-layer boards sometime don't pull solder all the way through the and plating can be damaged.
    Last edited by Galvonaut; 10-25-2013 at 03:56. Reason: superfluous word

  3. #13
    Join Date
    Jun 2010
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    Australia
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    Quote Originally Posted by Galvonaut View Post
    Good point dnar. My usual first step is running a soldering iron over everything that looks even in the slightest bit dry. Also, multi-layer boards sometime don't pull solder all the way through the and plating can be damaged.
    The joints wont look dry, they just form well over the pad without making contact with copper... Very odd, had me stumped for a while. I learnt to scrape the coating off before soldering.

    EDIT: sorry for the bad use of space bar, this screen keyboard on the tabletnshits me to tears...
    This space for rent.

  4. #14
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    Aug 2013
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    West Sussex
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    Quote Originally Posted by dnar View Post
    The joints wont look dry, they just form well over the pad without making contact with copper... Very odd, had me stumped for a while. I learnt to scrape the coating off before soldering.

    EDIT: sorry for the bad use of space bar, this screen keyboard on the tabletnshits me to tears...
    Maybe some solder-resist left on there from mfgr. ?

  5. #15
    Join Date
    Jun 2010
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    Australia
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    Quote Originally Posted by Galvonaut View Post
    Maybe some solder-resist left on there from mfgr. ?
    Something like that, I thought they had been conformal coated without masking the connection pads first. Dont get me started on the pad hole sizes...... huge holes for small gauge inputs and tiny friken holes in hard to reach locations for LD connections...
    This space for rent.

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